Bechtel has been chosen to construct Intel’s new semiconductor manufacturing facilities in New Albany, Licking County, Ohio, US.

This investment by Intel will bolster economic development in the region.

Bechtel’s manufacturing and technology business president Catherine Hunt Ryan said: “Bechtel is proud to work with Intel and the people of Ohio to reclaim U.S. semiconductor manufacturing.

“A project of this complexity and magnitude—with an outsized impact on the community and economy—is the type of work Bechtel is uniquely positioned to deliver. We are honoured to be chosen by Intel as its partner and we are ready to build their most advanced semiconductor facilities in the world.”

Intel corporate vice president for global supply chain operations Jackie Sturm said: “Intel has chosen Bechtel to deliver our largest construction project to date, advancing our mission to create a more sustainable, resilient, and geographically balanced supply of silicon.

“Bechtel has decades of world class expertise in complex global construction projects, leveraging a deeply experienced team, critical craft support and robust analytics platforms. Their relentless focus on safety, quality and innovation aligns with Intel key values. We look forward to building the future of U.S. semiconductor manufacturing together.”

Bechtel will be responsible for the design and building Phase 1 of the Intel Ohio project, a total of 2.5 million ft2.

Construction of the facilities will need as much steel as eight Eiffel Towers and as much concrete as the tallest skyscrapers.

The new facilities will manufacture Intel’s chips to meet growing demand for advanced semiconductors.



Image: Bechtel will be responsible for the design and building Phase 1 of the Intel Ohio project. Credit: Marcin from Pixabay.