Kingspan Group has patented a process for producing hydrophobized thermal-insulation bodies with specific ingredients and properties. The method involves pressing a mixture containing silica, IR opacifier, hexamethyldisilazane, and organosilicon compound B. The resulting product has a density of 50-300 g/l and compressive strength of 65-150 kPa. GlobalData’s report on Kingspan Group gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Kingspan Group, was a key innovation area identified from patents. Kingspan Group's grant share as of May 2024 was 51%. Grant share is based on the ratio of number of grants to total number of patents.
A recently granted patent (Publication Number: US11987528B2) discloses a process for producing a hydrophobized shaped thermal-insulation body. The process involves pressing or compacting a thermal-insulation mixture containing specific components such as silica, an IR opacifier, and organosilicon compounds A and B. The resulting thermal-insulation body has a density of 50 to 300 g/l and a compressive strength of 65 to 150 kPa. The mixture also includes water and may contain fibers, with the preparation carried out at a temperature of 10°C to 40°C. The molar ratio of organosilicon compound A to organosilicon compound B to water is specified, and the shaped body undergoes maturation and heat treatment post-compaction.
Furthermore, the patent claims detail the specific types of silica and IR opacifiers that can be used in the process, including aerogels, xerogels, titanium dioxide, and carbon blacks, among others. The time frame for adding organosilicon compounds A and B to the mixture before pressing or compacting is limited to 30 minutes, and the maturation and heat treatment temperatures and durations are also defined. The process aims to produce a hydrophobized thermal-insulation body with desirable properties for various applications.
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