Micron Technology will begin construction on a new $100bn semiconductor megafab in Onondaga County, New York, with an official groundbreaking on 16 January 2026.

The project follows completion of environmental reviews and the receipt of required permits, allowing ground preparation and building work to begin.

Company leaders, including chairman, president and CEO Sanjay Mehrotra, will take part in the ceremony alongside officials from federal, state and local government, as well as business community representatives.

The site in Clay, New York, is set to become the largest semiconductor fabrication plant in the US and represents the most significant private investment ever made in New York state.

Micron intends to invest up to $100bn over more than 20 years to build as many as four fabs, with an initial $20bn phase targeted for completion by 2030.

The facility is designed with sustainability targets in mind and could include four cleanrooms covering a combined 2.4 million ft².

The development forms part of Micron’s strategy to raise its American-made DRAM production to 40% of global output within ten years.

The company expects that ramping up production at the New York site will contribute to meeting increasing demand for memory components used in artificial intelligence systems and other technology sectors central to current economic trends.

Micron’s investments are supported by incentives at multiple government levels.

The company has secured up to $6.4bn in CHIPS Act direct funding for work on facilities in Idaho and New York as well as expansion in Virginia.

The State of New York has allocated up to $5.5bn in GREEN CHIPS incentives for this project’s duration.

Overall, Micron anticipates eligibility for the Advanced Manufacturing Investment Credit (AMIC) across its US developments.

The company projects that its New York megafab will create close to 50,000 jobs statewide, which includes around 9,000 direct Micron positions.