Intel has broken ground on $20bn semiconductor facility in Ohio, as part of its plans to invest $100bn in the US state over the next decade.

The groundbreaking ceremony was attended by US President Joe Biden, Ohio Governor Mike DeWine and other federal, state, and local officials.

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The first phase will see Intel offering $17.7m for eight proposals from institutions and collaborators in Ohio to develop semiconductor-focused education and workforce programmes.

Intel CEO Pat Gelsinger said: “This marks a pivotal moment in the journey to build a more geographically balanced and resilient semiconductor supply chain.

“The establishment of the Silicon Heartland is testament to the power of government incentives to unlock private investment, create thousands of high-paying jobs, and benefit U.S. economic and national security.”

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The plant is expected to create 7,000 construction jobs and 3,000 long-term positions in engineering, and manufacturing space.

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The $20bn semiconductor facility is one of the first chip-making facilities in the country following the recently passed CHIPS and Science Act.

Intel had postponed the facility’s groundbreaking ceremony as its plans largely depended “on funding from the CHIPS Act”, reported IANS via The New Indian Express.

August, Biden had signed the $280bn tech and science bill and called it “a once in a generation investment in America itself.”
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Image: The plant is expected to create thousands of jobs in Ohio. Credit: Marcin from Pixabay .