Construction work on Lehi Semiconductor Wafer Fabrication Plant II located in Lehi, Utah, the US commenced in Q4 2023, after the project was announced in Q1 2023. According to GlobalData, who tracks and profiles more than 220,000 major construction projects from announcement to completion, the project is expected to be completed by Q1 2026. To learn more about the Lehi Semiconductor Wafer Fabrication Plant II project, buy the profile here.
The project involves the construction of new 300mm semiconductor wafer fabrication plant in Lehi, Utah, the US.
The project includes the following:
1. Construction of production units
2. Construction of storage units
3. Construction of laboratories
4. Construction of control rooms
5. Construction of an office space
6. Installation of equipment and machinery
7. Installation of safety and security systems
Construction on the project is expected to be completed by Q1 2026.
For more details on the Lehi Semiconductor Wafer Fabrication Plant II project, buy the profile here.
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