Sumitomo Osaka Cement has been granted a patent for an electrostatic chuck device that aims to reduce non-uniformity of etching in a wafer. The device includes a sample mounting surface, a cooling base part, and an adhesive layer that bonds the two together. The cooling base part also functions as an RF electrode, and a third electrode is provided between the chuck part and the cooling base part. The third electrode is insulated from the cooling base part and is surrounded by an organic insulating material. GlobalData’s report on Sumitomo Osaka Cement gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Sumitomo Osaka Cement, electrode active materials was a key innovation area identified from patents. Sumitomo Osaka Cement's grant share as of June 2023 was 1%. Grant share is based on the ratio of number of grants to total number of patents.
Patent granted for an electrostatic chuck device with improved etching uniformity
A recently granted patent (Publication Number: US11664261B2) describes an electrostatic chuck device used for mounting samples. The device consists of an electrostatic chuck part with a sample mounting surface and a first electrode for electrostatic attraction. A cooling base part is placed on the opposite side of the sample mounting surface to cool the electrostatic chuck part. The two parts are bonded together using an insulating adhesive layer made of an organic insulating material.
The cooling base part also functions as a second electrode, specifically an RF electrode. The device further includes a third electrode, which can be connected to a high-frequency power source or LC resonance circuit. The third electrode is surrounded by the organic insulating material on its side surface and is located within the insulating adhesive layer. It is a metal foil with a thickness ranging from 5 µm to 500 µm. The third electrode is bonded to both the electrostatic chuck part and the cooling base part, while being insulated from the cooling base part through the insulating adhesive layer.
Additional claims in the patent describe variations of the electrostatic chuck device. Claim 2 states that the third electrode can be positioned between the sample mounting surface and the cooling base part. Claim 3 specifies that the third electrode is made of a nonmagnetic material. Claim 4 introduces a fourth electrode for RF electrode or LC adjustment, which is also bonded to the electrostatic chuck part and the cooling base part while being insulated from the cooling base part. Claim 5 states that the fourth electrode is surrounded by an organic insulating material.
Other claims describe the inclusion of a structure mounting surface for mounting an annular structure around the sample mounting surface (Claim 6), bonding the fourth electrode to the electrostatic chuck part with an organic material (Claim 7), and using a nonmagnetic material for the fourth electrode (Claim 8). Claim 9 specifies that the fourth electrode can be a metal foil with a thickness of 5 µm to 500 µm. Claim 10 states that there can be one or more of both the third and fourth electrodes. Claim 11 mentions that the third and fourth electrodes are insulated from each other with an insulating organic material.
The patent also includes claims related to the sheet resistance and thickness of the first electrode (Claim 12), the composition of the insulating adhesive layer (Claims 13-16), and the surrounding of the third electrode by the organic insulating material (Claim 17). Finally, Claim 18 describes the provision of three insulating adhesive layers on the top, side, and bottom surfaces of the third electrode.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
