Hillman Solutions saw the highest growth of 126% in patent filings in November and 108% in grants in October in Q4 2023. Compared to Q3 2023, Q4 2023 saw an increase in patent filings by 65% and grants by 108%. GlobalData’s DataBook provides a comprehensive analysis of Hillman Solutions’s patent filings and grants. Buy the databook here.
Hillman Solutions has been focused on protecting inventions in United States(US) with 74 publications in Q4 2023
The United States(US) Patent Office dominates the patent filings and grants with nearly 32% filings and 42% grants. The United States(US), China(CN), European Patent Office(EPO), and Japan(JP) patent Office are among the top ten patent offices where Hillman Solutions is filings its patents. Among the top granted patent authorities, Hillman Solutions has 42% of its grants in United States(US), 21% in Japan(JP) and 9% in China(CN).
Patents related to climate change and emissions reduction lead Hillman Solutions's portfolio
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Hillman Solutions has the highest number of patents in climate change followed by, emissions reduction and batteries. For climate change, nearly 16% of patents were filed and 19% of patents were granted in Q4 2023.
Printed circuit manufacturing related patents lead Hillman Solutions portfolio followed by exploration, and semiconductors
Hillman Solutions has highest number of patents in printed circuit manufacturing followed by exploration, semiconductors, telecom infrastructure, and manufacturing/industrial. For printed circuit manufacturing, nearly 19% of patents were filed and 9% of patents were granted in Q4 2023.
For comprehensive analysis of Hillman Solutions's filings and grants, buy the databook here.
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