Kioxia begins construction of semiconductor fabrication facility in Japan

WCN Editorial Team 6 Apr 2022 ASIA ENERGY & UTILITIES

Kioxia, memory solutions provider, has held a groundbreaking ceremony for its semiconductor fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan.

Leveraging AI-based ‘cutting-edge’ manufacturing, the new plant will expand production of the company’s 3D flash memory BiCS FLASHTM at the Kitakami Plant.

Construction of the Fab2 facility is slated for completion in 2023.

Besides featuring an earthquake-absorbing structure, the Fab2 facility will have an environmentally friendly design that will utilise advanced energy saving manufacturing equipment and renewable energy sources.

Furthermore, an administration building will be built to accommodate the control management and technical departments in response to the growing staff.

Kioxia president and CEO Nobuo Hayasaka said: “As a leader in memory, this Fab2 facility will become Kioxia’s key manufacturing hub to produce our memory products at scale. We are planning to introduce automated in-facility transfers and advanced production control to make Fab2 a truly world-class smart fabrication facility.

“Fab2 will be able to intelligently coordinate and optimize its production with Fab1 at Kitakami Plant as well as our fabs in the Yokkaichi Plant, enabling the company to seize opportunities in the growing memory market in a timely manner.”

Kioxia stated that it is focused on bolstering competitiveness of its memory and SSD business, which the firm has developed over the past 35 years since inventing NAND flash memory in 1987.


Image: Artist's impression of Fab2, Kitakami Plant Credit: Graphic: Business Wire/Kioxia.

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