Sumitomo Osaka Cement patented an electrostatic chuck device with a sample placing surface, first electrode for electrostatic attraction, cooling base part, and adhesive layer. The device features specific sheet resistance values and design elements for improved performance. GlobalData’s report on Sumitomo Osaka Cement gives a 360-degree view of the company including its patenting strategy. Buy the report here.
According to GlobalData’s company profile on Sumitomo Osaka Cement, Electrode active materials was a key innovation area identified from patents. Sumitomo Osaka Cement's grant share as of January 2024 was 30%. Grant share is based on the ratio of number of grants to total number of patents.
Electrostatic chuck device with improved bonding and cooling capabilities
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The granted patent (Publication Number: US11887877B2) discloses an electrostatic chuck device designed for holding samples in place during processes like semiconductor manufacturing. The device comprises an electrostatic chuck part with a sample placing surface and a first electrode for electrostatic attraction, a cooling base part to cool the chuck part, and an adhesive layer bonding the two parts together. The chuck part has a recess, the cooling base part has a protrusion, and the adhesion layer runs along these features. The first electrode has a specific sheet resistance value, and the adhesion layer ensures the secure connection of the chuck part and the cooling base part.
Furthermore, the patent details additional features of the electrostatic chuck device, such as the connection of the cooling base part to a high-frequency power source through a matching box, the use of a high-frequency cutoff filter for the first electrode's connection to a direct-current power source, and the presence of additional electrodes for electrostatic attraction. These additional electrodes have specific sheet resistance values and are connected to power sources through matching boxes or variable conductors. The design also includes a structure installation surface for surrounding the sample placing surface, with multiple electrodes provided for enhanced functionality. Overall, the patent outlines a comprehensive electrostatic chuck device with various electrodes and cooling mechanisms to ensure efficient sample holding and processing in semiconductor manufacturing applications.
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