Sumitomo Osaka Cement has filed a patent for an optical modulator that reduces transmission loss from a driver circuit element to a modulation substrate. The modulator includes a modulation substrate with an optical waveguide and modulation electrode, a driver circuit element, and a case. An output terminal and a wiring substrate are positioned above the driver circuit element and modulation substrate to connect the output terminal and modulation electrode. GlobalData’s report on Sumitomo Osaka Cement gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on Sumitomo Osaka Cement, Electrode active materials was a key innovation area identified from patents. Sumitomo Osaka Cement's grant share as of September 2023 was 30%. Grant share is based on the ratio of number of grants to total number of patents.
Optical modulator with reduced transmission loss from driver circuit
A recently filed patent (Publication Number: US20230314851A1) describes an optical modulator and an optical transmission apparatus. The optical modulator includes a modulation substrate with an optical waveguide and a modulation electrode for modulating a light wave. It also includes a driver circuit element that generates a modulation signal and a case that accommodates both the modulation substrate and the driver circuit element. The output terminal for the modulation signal is located on the upper surface of the driver circuit element. Additionally, a wiring substrate is positioned above the driver circuit element and the modulation substrate, with wiring that electrically connects the output terminal and the modulation electrode.
In claim 2, it is mentioned that the wiring of the wiring substrate is electrically connected to the output terminal and the modulation electrode through flip-chip bonding. This bonding technique ensures a reliable and efficient electrical connection between the components.
Claim 3 states that the wiring substrate is designed to receive differential signals from the driver circuit element and output only one signal to the modulation electrode. This allows for the modulation of the light wave with a single signal, simplifying the overall design and operation of the optical modulator.
Claim 4 introduces the concept of a terminator provided in the wiring substrate. This terminator terminates the other signal of the differential signals, further enhancing the performance and functionality of the optical modulator.
In claim 5, it is specified that the terminator is positioned on the back side of the wiring substrate, facing away from the modulation substrate. This arrangement ensures efficient termination of the signal and optimal signal transmission within the optical modulator.
Claim 6 mentions the inclusion of heat radiation means in the wiring substrate to dissipate heat generated from the terminator. This feature helps in maintaining the optimal operating temperature of the optical modulator, ensuring its reliability and longevity.
Finally, claim 7 describes an optical transmission apparatus that includes the aforementioned optical modulator and a signal generator that generates the modulation signal to be input to the driver circuit element. This apparatus can be used in various optical communication systems and networks.
Overall, the patent describes an optical modulator and an optical transmission apparatus with various innovative features and configurations. These advancements aim to improve the performance, reliability, and efficiency of optical communication systems.
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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
