Toshiba to build new $3.2bn semiconductor fabrication facility in Japan

WCN Editorial Team 21 Mar 2016 ASIA BUILDINGS

Toshiba has announced plans to build a new semiconductor fabrication facility in Japan’s Mie prefecture.

The new Fab 2 building will be built on land adjacent to the Yokkaichi Operations memory production complex in Mie prefecture. It will be used for expanded production of the company’s proprietary 3D flash memory product brand Bics Flash.

Production requires needs a new clean room with dedicated equipment for the 3D process. The new facility will initially offer this space following its completion in the first half of fiscal 2016.

The construction and equipment investment for the project is estimated to cost about JPY360bn ($3.2bn). The investment will take place from fiscal 2016 to fiscal 2018.

Final decisions on the construction timeline and facility investment will be made in fiscal 2016, with production due to start in 2018.

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