Samsung Electronics breaks ground on new EUV line in Hwaseong, Korea

WCN Editorial Team 27 Feb 2018 ASIA BUSINESS

Samsung Electronics, involved in the manufacture of advanced semiconductor technology, has broken ground on a new extreme ultraviolet (EUV) line in Hwaseong, Korea.

With the new EUV line, the company aims to be in a position to strengthen its leadership in the single nanometer process technology by responding to market demand from various applications, including mobile, server, network, and HPC (high performance computing).

High performance and power efficiency are critical for these applications.

The new facility is expected to be completed in the second half of 2019 and be ready for production in 2020.

Initial investment in the EUV line is expected to reach $6bn by 2020.

Additional investment will be determined depending on market circumstances.

Samsung Electronics president and CEO of device solutions Kinam Kim said: “With the addition of this new EUV line, Hwaseong will become the centre of the company’s semiconductor cluster spanning Giheung, Hwaseong and Pyeongtaek.

“The line will play a pivotal role as Samsung seeks to maintain a competitive edge as an industry leader in the coming age of the Fourth Industrial Revolution.”

The company has decided to utilise latest EUV technology starting with its 7-nanometer (nm) LPP (Low Power Plus) process.

The new line will be established with EUV lithography equipment to overcome nano-level technology limitations.

Samsung continues to invest in EUV R&D to support its global customers for developing next-generation chips based on this technology.

Earlier in February 2018, Samsung and Qualcomm Technologies announced plans to expand their decade-long foundry relationship into EUV lithography process technology, including the manufacture of future Qualcomm Snapdragon 5G mobile chipsets using Samsung’s 7-nanometer LPP EUV process technology.

Using 7LPP EUV process technology, Snapdragon 5G mobile chipsets will offer a smaller chip footprint, giving OEMs more usable space inside upcoming products to support larger batteries or slimmer designs.

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