Bosch to build new semiconductor fabrication facility in Germany

WCN Editorial Team 21 Jun 2017 EUROPE BUSINESS

Robert Bosch, a Germany-based auto component maker, has unveiled its plans to build a new semiconductor fabrication facility in Dresden, Germany.

The new factory, which will be constructed with an investment of €1bn, will manufacture chips on the basis of 12-inch wafer to meet the demand generated by the future generations of autonomous vehicles and growing number of internet of things (IoT).

Construction on the fabrication facility is scheduled to be completed by the end of 2019 while manufacturing operations are likely to begin in 2021 after a rollout phase. The factory will create up to 700 new jobs.

Pending receipt of the approval of the European Commission, the German Ministry for Economic Affairs and Energy (BMWi) plans to support the construction and commissioning of the new wafer fabrication facility in Dresden.

Robert Bosch member of the board of management Dirk Hoheisel said: “As an industrial location, the state of Saxony offers excellent conditions for enhancing our semiconductor expertise.”

German Federal Minister for Economic Affairs and Energy Brigitte Zypries said: “We applaud Bosch’s decision to invest in Saxony. Strengthening semiconductor expertise in Germany, and thus in Europe as well, is an investment in a key technology of the future, and thus a very important step toward preserving and enhancing competitiveness, also of Germany as an industrial location.”

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